Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Chip package structure with nickel layer

Chip package structure with nickel layer

US Patent 12125715 · Granted Oct 22, 2024

Estimated economic value: $19,443,000 ⓘ

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Bonding structures in semiconductor packaged device and method of forming same2025
Semiconductor die package with conductive line crack prevention design2025
Methods of servicing photolithographic apparatus2025
Chip package structure with metal-containing layer2025
Chip package structure with metal-containing layer2025
Chip package structure with metal-containing layer2025
Semiconductor device structure with magnetic element2025
Semiconductor device and method2025
Method for making a packaging substrate2025
Semiconductor device structure with a protection cap at an end portion of a cond2025
Semiconductor device with discrete blocks2025
Lthc as charging barrier in info package formation2025