Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Press-fit power module and related methods

Press-fit power module and related methods

US Patent 12119576 · Granted Oct 15, 2024

Estimated economic value: $162,168,000 ⓘ

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Solderless and pressure contact connection2025
Flexible clip with aligner structure2025
Method for treating polluted acidic wastewater from smelting with activated pyri2025
Leadframeless electrically isolated power semiconductor package2025
Power module package2025
Module with substrate recess for conductive-bonding component2025
Module with substrate recess for conductive-bonding component2025
Data cable2025
Encapsulation structure and encapsulation method of power module2025
Power substrate assembly with reduced warpage2025
Dual cool power module with stress buffer layer2025
Dual side direct cooling semiconductor package2025