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Home › Integrated circuit (IC) package employing added metal for embedded metal traces in ETS-based substrate for reduced signal path impedance, and related fabrication methods

Integrated circuit (IC) package employing added metal for embedded metal traces in ETS-based substrate for reduced signal path impedance, and related fabrication methods

US Patent 12100645 · Granted Sep 24, 2024

Estimated economic value: $33,492,000 ⓘ

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