Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Methods of detecting non-conforming substrate processing events during chemical mechanical polishing

Methods of detecting non-conforming substrate processing events during chemical mechanical polishing

US Patent 12036635 · Granted Jul 16, 2024

Estimated economic value: $116,305,000 ⓘ

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Transportation system2025
Substrate handling systems and methods for CMP processing2025
Object synchronization apparatus and method2025
Eddy current monitoring to detect vibration in polishing2025
Multiple disk pad conditioner2025
Tongs2025
Automated dry-in dry-out dual side polishing of silicon substrates with integrat2024
Retaining ring having inner surfaces with features2024
Retaining ring having inner surfaces with facets2024
Chemical mechanical polishing system with platen temperature control2024
Chemical mechanical polishing system with platen temperature control2024
Polishing system with platen for substrate edge control2024