Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Cavity formed in a molding compound of a semiconductor package to reduce mechanical stress on a portion of a die in the package, and methods of formation

Cavity formed in a molding compound of a semiconductor package to reduce mechanical stress on a portion of a die in the package, and methods of formation

US Patent 11984408 · Granted May 14, 2024

Estimated economic value: $52,439,000 ⓘ

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Display panel, display panel driving method and display device2025
Road side vehicle occupancy detection system2025
Display module and driving method thereof, and display device2025
Method for manufacturing double-layer fair mugs2024
QFN semiconductor package, semiconductor package and lead frame2024
QFN semiconductor package, semiconductor package and lead frame2024
Circular bond finger pad2024
Automated analytical model retraining with a knowledge graph2024
Approaches for knowledge graph pruning based on sampling and information gain th2024
Lead-frame assembly, semiconductor package and methods for improved adhesion2024
Pixel driving circuit and driving method thereof, light-emitting panel, and disp2023
Road side vehicle occupancy detection system2023