Integration scheme for breakdown voltage enhancement of a piezoelectric metal-insulator-metal device

Assignee

• TSMC

Inventors

• Anderson Lin (10 patents)
• Chun-Ren Cheng (118 patents)
• Chi-Yuan Shih (57 patents)
• Shih-Fen Huang (66 patents)
• Yi-Chuan Teng (46 patents)
• Yi Heng Tsai (36 patents)
• You-Ru Lin (30 patents)
• Yen-Wen Chen (30 patents)
• Fu-Chun Huang (34 patents)
• Fan Hu (27 patents)
• Ching-Hui Lin (73 patents)
• Yan-Jie Liao (11 patents)

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