Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › In-situ encapsulation of metal-insulator-metal (MIM) stacks for resistive random access memory (RERAM) cells

In-situ encapsulation of metal-insulator-metal (MIM) stacks for resistive random access memory (RERAM) cells

US Patent 11882776 · Granted Jan 23, 2024

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Methods and structures for increasing stability of soft or organic features2025
Extreme ultraviolet lithography patterning method2025
Patterning features with metal based resists2025
Patterning features with metal based resists2025
Double hardmasks for self-aligned multi-patterning processes2025
Double patterning method of patterning a substrate2025
Metal hard mask integration2025
Metal hard mask integration2025
Selective film formation using a self-assembled monolayer2025
Method for patterning a substrate using photolithography2025
Method for patterning a substrate using photolithography2025
Pitch scaling in microfabrication2025