Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Through-substrate-via with reentrant profile

Through-substrate-via with reentrant profile

US Patent 11862535 · Granted Jan 2, 2024

Estimated economic value: $6,531,000 ⓘ

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Crank apparatus equipped with labor-saving mechanism and bicycle crank assembly2025
Control chip and control method thereof2025
Stilted pad structure2025
3DIC seal ring structure and methods of forming same2025
Semiconductor devices and methods of manufacture thereof2025
Stacked substrate structure with inter-tier interconnection2025
Passivation layer for epitaxial semiconductor process2025
Metal-insulator-metal device with improved performance2025
Metal-insulator-metal device with improved performance2025
Hybrid bonding technology for stacking integrated circuits2025
Hybrid bonding technology for stacking integrated circuits2025
Self aligned grids in BSI image sensor2025