EUV lithography system with 3D sensing and tunning modules

Assignee

• TSMC

Inventors

• Tai-Yu Chen (88 patents)
• Tzu-Jung Pan (5 patents)
• Kuan-Hung Chen (80 patents)
• Sheng-Kang Yu (50 patents)
• Shang-Chieh Chien (168 patents)
• Li-Jui Chen (264 patents)
• Heng-Hsin Liu (125 patents)

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