Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Semiconductor package and related methods

Semiconductor package and related methods

US Patent 11830856 · Granted Nov 28, 2023

Estimated economic value: $42,656,000 ⓘ

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Power module2025
Power module2025
Silicon-on-insulator die support structures and related methods2025
Leadless semiconductor packages, leadframes therefor, and methods of making2025
Stacked power terminals in a power electronics module2025
Stacked power terminals in a power electronics module2025
Power circuit module2025
Semiconductor packages with die including cavities and related methods2025
Die sidewall coatings and related methods2025
Low stress asymmetric dual side module2025
Low stress asymmetric dual side module2025
Low stress asymmetric dual side module2025