Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Bonded assembly of a memory die and a logic die including laterally shifted bit-line bonding pads and methods of forming the same

Bonded assembly of a memory die and a logic die including laterally shifted bit-line bonding pads and methods of forming the same

US Patent 11758730 · Granted Sep 12, 2023

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Non-volatile memory with inter-die connection2025
Three-dimensional memory device with high contact via density and methods of for2025
Three-dimensional memory device with high contact via density and methods of for2025
Data latch programming algorithm for multi-bit-per-cell memory devices2025
Three-dimensional memory array with dual-level peripheral circuits and methods f2025
Three-dimensional memory array with dual-level peripheral circuits and methods f2024
Non-volatile memory with efficient signal routing2024
Non-volatile memory with three dimensional stacked word line switches2024
Non-volatile memory with efficient word line hook-up2024
Non-volatile memory with different word line hook up regions based on pass throu2023
Three-dimensional memory device having support-die-assisted source power distrib2023
Three-dimensional memory device with separated contact regions and methods for f2023