Component assemblies and embedding for high density electronics

Assignee

• Kemet Electronics

Inventors

• John Bultitude (62 patents)
• Peter Blais (4 patents)
• James A. Burk (3 patents)
• Galen W. Miller (13 patents)
• Hunter Hayes (3 patents)
• Allen Templeton (8 patents)
• Lonnie G. Jones (21 patents)
• Mark R. Laps (6 patents)

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