Issued Patents All Time
Showing 25 most recent of 62 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12249463 | Multi-terminal MLCC for improved heat dissipation | Mark R. Laps, Philip M. Lessner, Lonnie G. Jones, Allen Templeton, Nathan A. Reed | 2025-03-11 |
| 12040135 | Resonant multilayer ceramic capacitors | Nathan A. Reed, Allen Templeton, James R. Magee, James Davis, Abhijit Gurav +2 more | 2024-07-16 |
| 11923151 | Structural lead frame | Galen W. Miller, Lonnie G. Jones | 2024-03-05 |
| 11744018 | Component assemblies and embedding for high density electronics | Peter Blais, James A. Burk, Galen W. Miller, Hunter Hayes, Allen Templeton +2 more | 2023-08-29 |
| 11621126 | Resonant multilayer ceramic capacitors | Nathan A. Reed, Allen Templeton, James R. Magee, James Davis, Abhijit Gurav +2 more | 2023-04-04 |
| 11432448 | Method of forming an electronic device | John E. McConnell | 2022-08-30 |
| 11393636 | Ceramic overvoltage protection device having low capacitance and improved durability | Iain D. Kinnon, Lonnie G. Jones | 2022-07-19 |
| 11393635 | Ceramic overvoltage protection device having low capacitance and improved durability | Iain D. Kinnon, Lonnie G. Jones | 2022-07-19 |
| 11227719 | Leadless multi-layered ceramic capacitor stack | John E. McConnell, Garry L. Renner, Allen Hill | 2022-01-18 |
| 11178800 | Ceramic overvoltage protection device having low capacitance and improved durability | Lonnie G. Jones, Iain D. Kinnon, Nathan A. Reed, Jeffrey W. Bell, George Michael Theis | 2021-11-16 |
| 11081882 | ESD suppression using light emissions | Lonnie G. Jones, Iain D. Kinnon, Nathan A. Reed, Jeffrey W. Bell | 2021-08-03 |
| 11037871 | Gate drive interposer with integrated passives for wide band gap semiconductor devices | Allen Templeton, Lonnie G. Jones, Philip M. Lessner | 2021-06-15 |
| 10984955 | Electronic component structures with reduced microphonic noise | John E. McConnell, Galen W. Miller | 2021-04-20 |
| 10950688 | Packages for power modules with integrated passives | Lonnie G. Jones, Allen Templeton, Philip M. Lessner | 2021-03-16 |
| 10840023 | Multilayered ceramic capacitor structures for use at high power | Philip M. Lessner, Abhijit Gurav | 2020-11-17 |
| 10790094 | Method of forming a leadless stack comprising multiple components | John E. McConnell, Garry L. Renner, R. Allen Hill, Galen W. Miller | 2020-09-29 |
| 10757811 | Higher density multi-component and serial packages | James A. Burk, Galen W. Miller | 2020-08-25 |
| 10757810 | High density multi-component packages | Galen W. Miller, John E. McConnell | 2020-08-25 |
| 10729051 | Component stability structure | John E. McConnell | 2020-07-28 |
| 10707145 | High density multi-component packages | Galen W. Miller, John E. McConnell | 2020-07-07 |
| 10681814 | High density multi-component packages | Galen W. Miller, John E. McConnell | 2020-06-09 |
| 10622157 | Multilayer ceramic structure | — | 2020-04-14 |
| 10593483 | Multilayer ceramic structure | — | 2020-03-17 |
| 10410794 | Multilayer ceramic structure | — | 2019-09-10 |
| 10381162 | Leadless stack comprising multiple components | John E. McConnell, Garry L. Renner, R. Allen Hill, Galen W. Miller | 2019-08-13 |