Issued Patents All Time
Showing 25 most recent of 44 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11432448 | Method of forming an electronic device | John Bultitude | 2022-08-30 |
| 11227719 | Leadless multi-layered ceramic capacitor stack | Garry L. Renner, John Bultitude, Allen Hill | 2022-01-18 |
| 10984955 | Electronic component structures with reduced microphonic noise | John Bultitude, Galen W. Miller | 2021-04-20 |
| 10790094 | Method of forming a leadless stack comprising multiple components | Garry L. Renner, John Bultitude, R. Allen Hill, Galen W. Miller | 2020-09-29 |
| 10757810 | High density multi-component packages | John Bultitude, Galen W. Miller | 2020-08-25 |
| 10729051 | Component stability structure | John Bultitude | 2020-07-28 |
| 10707145 | High density multi-component packages | John Bultitude, Galen W. Miller | 2020-07-07 |
| 10681814 | High density multi-component packages | John Bultitude, Galen W. Miller | 2020-06-09 |
| 10381162 | Leadless stack comprising multiple components | Garry L. Renner, John Bultitude, R. Allen Hill, Galen W. Miller | 2019-08-13 |
| 10366836 | Electronic component structures with reduced microphonic noise | John Bultitude, Galen W. Miller | 2019-07-30 |
| 10229785 | Multi-layered ceramic capacitor with soft leaded module | Alan P. Webster, Lonnie G. Jones, Garry L. Renner, Jeffrey W. Bell | 2019-03-12 |
| 10224149 | Bulk MLCC capacitor module | Galen W. Miller, John Bultitude, Garry L. Renner | 2019-03-05 |
| 10068707 | Leadless multi-layered ceramic capacitor stacks | Garry L. Renner, John Bultitude, Allen Hill | 2018-09-04 |
| 9881744 | Electronic component termination and assembly by means of transient liquid phase sintering metalurgical bonds | Garry L. Renner, John Bultitude | 2018-01-30 |
| 9805872 | Multiple MLCC modules | Galen W. Miller, John Bultitude, Garry L. Renner | 2017-10-31 |
| 9793057 | Electronic component termination and assembly by means of transient liquid phase sintering metallurgical bond | Garry L. Renner, John Bultitude | 2017-10-17 |
| 9779874 | Sintering of high temperature conductive and resistive pastes onto temperature sensitive and atmospheric sensitive materials | John Bultitude, Abhijit Gurav | 2017-10-03 |
| 9748043 | Method of improving electromechanical integrity of cathode coating to cathode termination interfaces in solid electrolytic capacitors | Antony P. Chacko, Robert Ramsbottom, Philip M. Lessner, Randolph S. Hahn, John Bultitude | 2017-08-29 |
| 9472342 | Leadless multi-layered ceramic capacitor stacks | Garry L. Renner, John Bultitude, Allen Hill | 2016-10-18 |
| 9357634 | Coefficient of thermal expansion compensating compliant component | Alan P. Webster, John Bultitude, Abhijit Gurav | 2016-05-31 |
| 9171672 | Stacked leaded array | John Bultitude, Lonnie G. Jones, Alan P. Webster | 2015-10-27 |
| 9025311 | Very large ceramic capacitor with mechanical shock resistance | John Bultitude, Abhijit Gurav | 2015-05-05 |
| 8988857 | High aspect ratio stacked MLCC design | Alan P. Webster, Lonnie G. Jones, Garry L. Renner, Jeffrey W. Bell | 2015-03-24 |
| 8910356 | Method of attaching an electronic device to an MLCC having a curved surface | Michael S. Randall, Chris Wayne | 2014-12-16 |
| 8904609 | Externally fused and resistively loaded safety capacitor | John Bultitude | 2014-12-09 |