| 11432448 |
Method of forming an electronic device |
John Bultitude |
2022-08-30 |
|
| 11227719 |
Leadless multi-layered ceramic capacitor stack |
Garry L. Renner, John Bultitude, Allen Hill |
2022-01-18 |
|
| 10984955 |
Electronic component structures with reduced microphonic noise |
John Bultitude, Galen W. Miller |
2021-04-20 |
|
| 10790094 |
Method of forming a leadless stack comprising multiple components |
Garry L. Renner, John Bultitude, R. Allen Hill, Galen W. Miller |
2020-09-29 |
|
| 10757810 |
High density multi-component packages |
John Bultitude, Galen W. Miller |
2020-08-25 |
|
| 10729051 |
Component stability structure |
John Bultitude |
2020-07-28 |
|
| 10707145 |
High density multi-component packages |
John Bultitude, Galen W. Miller |
2020-07-07 |
|
| 10681814 |
High density multi-component packages |
John Bultitude, Galen W. Miller |
2020-06-09 |
$14,817,000 |
| 10381162 |
Leadless stack comprising multiple components |
Garry L. Renner, John Bultitude, R. Allen Hill, Galen W. Miller |
2019-08-13 |
$6,278,000 |
| 10366836 |
Electronic component structures with reduced microphonic noise |
John Bultitude, Galen W. Miller |
2019-07-30 |
$15,188,000 |
| 10229785 |
Multi-layered ceramic capacitor with soft leaded module |
Alan P. Webster, Lonnie G. Jones, Garry L. Renner, Jeffrey W. Bell |
2019-03-12 |
$12,130,000 |
| 10224149 |
Bulk MLCC capacitor module |
Galen W. Miller, John Bultitude, Garry L. Renner |
2019-03-05 |
$6,054,000 |
| 10068707 |
Leadless multi-layered ceramic capacitor stacks |
Garry L. Renner, John Bultitude, Allen Hill |
2018-09-04 |
$5,895,000 |
| 9881744 |
Electronic component termination and assembly by means of transient liquid phase sintering metalurgical bonds |
Garry L. Renner, John Bultitude |
2018-01-30 |
$16,720,000 |
| 9805872 |
Multiple MLCC modules |
Galen W. Miller, John Bultitude, Garry L. Renner |
2017-10-31 |
$10,722,000 |
| 9793057 |
Electronic component termination and assembly by means of transient liquid phase sintering metallurgical bond |
Garry L. Renner, John Bultitude |
2017-10-17 |
$7,978,000 |
| 9779874 |
Sintering of high temperature conductive and resistive pastes onto temperature sensitive and atmospheric sensitive materials |
John Bultitude, Abhijit Gurav |
2017-10-03 |
$14,369,000 |
| 9748043 |
Method of improving electromechanical integrity of cathode coating to cathode termination interfaces in solid electrolytic capacitors |
Antony P. Chacko, Robert Ramsbottom, Philip M. Lessner, Randolph S. Hahn, John Bultitude |
2017-08-29 |
$13,757,000 |
| 9472342 |
Leadless multi-layered ceramic capacitor stacks |
Garry L. Renner, John Bultitude, Allen Hill |
2016-10-18 |
$2,026,000 |
| 9357634 |
Coefficient of thermal expansion compensating compliant component |
Alan P. Webster, John Bultitude, Abhijit Gurav |
2016-05-31 |
$1,974,000 |
| 9171672 |
Stacked leaded array |
John Bultitude, Lonnie G. Jones, Alan P. Webster |
2015-10-27 |
$1,625,000 |
| 9025311 |
Very large ceramic capacitor with mechanical shock resistance |
John Bultitude, Abhijit Gurav |
2015-05-05 |
$1,829,000 |
| 8988857 |
High aspect ratio stacked MLCC design |
Alan P. Webster, Lonnie G. Jones, Garry L. Renner, Jeffrey W. Bell |
2015-03-24 |
$2,009,000 |
| 8910356 |
Method of attaching an electronic device to an MLCC having a curved surface |
Michael S. Randall, Chris Wayne |
2014-12-16 |
$2,012,000 |
| 8904609 |
Externally fused and resistively loaded safety capacitor |
John Bultitude |
2014-12-09 |
$2,146,000 |