| 11923151 |
Structural lead frame |
John Bultitude, Lonnie G. Jones |
2024-03-05 |
| 11744018 |
Component assemblies and embedding for high density electronics |
John Bultitude, Peter Blais, James A. Burk, Hunter Hayes, Allen Templeton +2 more |
2023-08-29 |
| 10984955 |
Electronic component structures with reduced microphonic noise |
John Bultitude, John E. McConnell |
2021-04-20 |
| 10790094 |
Method of forming a leadless stack comprising multiple components |
John E. McConnell, Garry L. Renner, John Bultitude, R. Allen Hill |
2020-09-29 |
| 10757811 |
Higher density multi-component and serial packages |
James A. Burk, John Bultitude |
2020-08-25 |
| 10757810 |
High density multi-component packages |
John Bultitude, John E. McConnell |
2020-08-25 |
| 10707145 |
High density multi-component packages |
John Bultitude, John E. McConnell |
2020-07-07 |
| 10681814 |
High density multi-component packages |
John Bultitude, John E. McConnell |
2020-06-09 |
| 10381162 |
Leadless stack comprising multiple components |
John E. McConnell, Garry L. Renner, John Bultitude, R. Allen Hill |
2019-08-13 |
| 10366836 |
Electronic component structures with reduced microphonic noise |
John Bultitude, John E. McConnell |
2019-07-30 |
| 10224149 |
Bulk MLCC capacitor module |
John E. McConnell, John Bultitude, Garry L. Renner |
2019-03-05 |
| 10178770 |
Higher density multi-component and serial packages |
James A. Burk, John Bultitude |
2019-01-08 |
| 9805872 |
Multiple MLCC modules |
John E. McConnell, John Bultitude, Garry L. Renner |
2017-10-31 |