Issued Patents All Time
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11744018 | Component assemblies and embedding for high density electronics | John Bultitude, Peter Blais, Galen W. Miller, Hunter Hayes, Allen Templeton +2 more | 2023-08-29 |
| 10757811 | Higher density multi-component and serial packages | John Bultitude, Galen W. Miller | 2020-08-25 |
| 10178770 | Higher density multi-component and serial packages | John Bultitude, Galen W. Miller | 2019-01-08 |