Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Bonding of bridge to multiple semiconductor chips

Bonding of bridge to multiple semiconductor chips

US Patent 11735575 · Granted Aug 22, 2023

Estimated economic value: $5,113,000 ⓘ

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Inductor and method for manufacturing inductor2025
Multichip interconnect package2025
Multichip interconnect package2025
Multichip interconnect package2025
X-ray CT apparatus and attaching method and detaching method of units within gan2025
Pure copper plate2025
Management system, management device, management method, and program2025
Copper alloy, plastically worked copper alloy material, component for electronic2025
Solid-state imaging apparatus and electronic apparatus2025
Fine-pitch joining pad structure2025
Fine-pitch joining pad structure2025
Layer-to-layer registration measurement mark2025