Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Multi-chip module having a stacked logic chip and memory stack

Multi-chip module having a stacked logic chip and memory stack

US Patent 11699681 · Granted Jul 11, 2023

Estimated economic value: $21,736,000 ⓘ

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Dielectric sidewall features for tuning thin film transistor (TFT) parasitics2025
Subtractively patterned interconnect structures for integrated circuits2025
Punch-through interconnect feature to couple upper electrodes of capacitors of m2025
End-to-end data protection for compute in memory (CIM)/compute near memory (CNM)2025
Cooling approaches for stitched dies2025
Compositional engineering of Schottky diode2025
Compositional engineering of Schottky diode2025
Capacitor connections in dielectric layers2025
Capacitor connections in dielectric layers2025
Back-side power delivery with glass support at the front2025
Bilayer memory stacking with computer logic circuits shared between bottom and t2025
Bilayer memory stacking with computer logic circuits shared between bottom and t2025