{"@context": "https://schema.org", "@type": "BreadcrumbList", "itemListElement": [{"@type": "ListItem", "position": 1, "name": "Home", "item": "https://www.patentleaderboard.com/"}, {"@type": "ListItem", "position": 2, "name": "Feature patterning using pitch relaxation and directional end-pushing with ion bombardment", "item": "https://www.patentleaderboard.com/patent/11688610"}]}

Home › Feature patterning using pitch relaxation and directional end-pushing with ion bombardment

Feature patterning using pitch relaxation and directional end-pushing with ion bombardment

US Patent 11688610 · Granted Jun 27, 2023

Estimated economic value: $9,906,000 ⓘ

Assignee

TSMC

Inventors

Tzung-Hua Lin (6 patents)
Yi-Ko CHEN (2 patents)
Chia-Chu Liu (40 patents)
Hua-Tai Lin (63 patents)

View full patent text on Google Patents →