Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Package-on-package (POP) electronic device and manufacturing method thereof

Package-on-package (POP) electronic device and manufacturing method thereof

US Patent 11670593 · Granted Jun 6, 2023

Estimated economic value: $8,286,000 ⓘ

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Method of singulating a semiconductor device2025
Method of singulating a semiconductor device2025
Package assembly including a package lid having a step region and method of maki2025
Connecting structure, package structure and manufacturing method thereof2025
Connecting structure, package structure and manufacturing method thereof2025
Integrated circuit structure, and method for forming thereof2025
Semiconductor package and method2025
Semiconductor package and method2025
Package structures2025
Using unsupervised clustering and language model to normalize attribute tuples o2025
Integrated circuit package and method2025
Integrated circuit package and method2025