Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Tungsten chemical mechanical polishing for reduced oxide erosion

Tungsten chemical mechanical polishing for reduced oxide erosion

US Patent 11643599 · Granted May 9, 2023

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Benign network entities based malicious campaign signature generation2025
Low dishing oxide CMP polishing compositions for shallow trench isolation applic2025
Low dishing oxide CMP polishing compositions for shallow trench isolation applic2025
Organoaminosilane precursors and methods for depositing films comprising same2025
High oxide film removal rate shallow trench (STI) chemical mechanical planarizat2024
High oxide film removal rate shallow trench (STI) chemical mechanical planarizat2024
Tungsten chemical mechanical planarization (CMP) with low dishing and low erosio2024
Capacitive touch sensor2023
Compositions and processes for depositing carbon-doped silicon-containing films2023
Chemical mechanical planarization composition for polishing oxide materials and 2023
Low oxide trench dishing chemical mechanical polishing2023
Low oxide trench dishing chemical mechanical polishing2023