Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Metal-free frame design for silicon bridges for semiconductor packages

Metal-free frame design for silicon bridges for semiconductor packages

US Patent 11626372 · Granted Apr 11, 2023

Estimated economic value: $27,486,000 ⓘ

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Data storage device and method for hybrid space balancing based on host read aff2025
Multi-chip packaging2025
Moisture seal coating of hybrid bonded stacked die package assembly2025
Substrateless double-sided embedded multi-die interconnect bridge2025
Steel material, for pressure vessel, showing excellent hydrogen-induced cracking2025
Multiple wafer stack architecture to enable singulation2025
Semiconductor package2025
Microelectronic structures including bridges2025
Nested architectures for enhanced heterogeneous integration2025
Alternative surfaces for conductive pad layers of silicon bridges for semiconduc2025
Alternative surfaces for conductive pad layers of silicon bridges for semiconduc2025
Semiconductor package2025