Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Process kit having tall deposition ring and smaller diameter electrostatic chuck (ESC) for PVD chamber

Process kit having tall deposition ring and smaller diameter electrostatic chuck (ESC) for PVD chamber

US Patent 11581167 · Granted Feb 14, 2023

Estimated economic value: $35,617,000 ⓘ

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Reduced substrate process chamber cavity volume2025
Methods and apparatus for wafer detection2025
Systems and methods for increasing blood flow2025
Substrate processing module and method of moving a workpiece2025
Apparatus for controlling lift pin movement2025
Molybdenum monolithic physical vapor deposition target2025
Methods for depositing film layers2025
Methods and apparatus for depositing amorphous indium tin oxide film2025
Semiconductor process equipment2025
Apparatus for improved high pressure plasma processing2025
Floating pin for substrate transfer2025
Shutter disk for physical vapor deposition (PVD) chamber2025