Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Package comprising an integrated device coupled to a substrate through a cavity

Package comprising an integrated device coupled to a substrate through a cavity

US Patent 11545439 · Granted Jan 3, 2023

Estimated economic value: $13,583,000 ⓘ

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Substrate(s) for an integrated circuit (IC) package employing a metal core for i2025
Substrate(s) for an integrated circuit (IC) package employing a metal core for i2025
Package with a substrate comprising embedded escape interconnects and surface es2025
Package with a substrate comprising embedded escape interconnects and surface es2025
Integrated circuit (IC) packages employing wire bond channel over package substr2025
Integrated circuit (IC) packages employing wire bond channel over package substr2025
Integrated circuit (IC) packages employing supplemental metal layer coupled to e2025
Integrated circuit (IC) package substrate with embedded trace substrate (ETS) la2025
Wafer processing apparatus with a rotatable table2025
Package comprising channel interconnects located between solder interconnects2025
Package comprising channel interconnects located between solder interconnects2025
Recess structure for padless stack via2025