Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Three dimensional semiconductor device containing composite contact via structures and methods of making the same

Three dimensional semiconductor device containing composite contact via structures and methods of making the same

US Patent 11515250 · Granted Nov 29, 2022

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Method of making high aspect ratio openings in a semiconductor device using ion 2025
Three-dimensional memory device including composite backside metal fill structur2025
Three-dimensional memory device including composite backside metal fill structur2025
Three-dimensional memory device and method of making thereof by non-conformal se2025
Three-dimensional memory device and method of making thereof by non-conformal se2025
Three-dimensional memory device and method of making thereof by non-conformal se2025
Growth of thin oxide layer with silicon nitride and conversion2025
Three-dimensional memory device with source line isolation and method of making 2025
Three-dimensional memory device containing engineered charge storage elements an2025
Three-dimensional memory device containing engineered charge storage elements an2025
Bonded assembly including interconnect-level bonding pads and methods of forming2025
Three-dimensional memory device including discrete charge storage elements and m2025