Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Measurement and control of wafer tilt for x-ray based metrology

Measurement and control of wafer tilt for x-ray based metrology

US Patent 11513085 · Granted Nov 29, 2022

Estimated economic value: $210,466,000 ⓘ

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Layer with discrete islands formed on a substrate support2025
Calibration courses and targets2025
Component calibration using motion capture sensor data2025
Cleanroom compatible robotic end effector exchange system2025
Platform with trench for optical fiber with sensors2025
Optical metrology in machine learning to characterize features2024
Processing chamber with optical fiber with bragg grating sensors2024
Method of etch model calibration using optical scatterometry2023
Multiphase ground fault circuit interrupter2023
Variable aperture mask2022
Methods and systems for characterization of an x-ray beam with high spatial reso2021
Method of etch model calibration using optical scatterometry2021