Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Substrate adsorption method, substrate holding apparatus, substrate polishing apparatus, elastic film, substrate adsorption determination method for substrate holding apparatus, and pressure control method for substrate holding apparatus

Substrate adsorption method, substrate holding apparatus, substrate polishing apparatus, elastic film, substrate adsorption determination method for substrate holding apparatus, and pressure control method for substrate holding apparatus

US Patent 11472000 · Granted Oct 18, 2022

Estimated economic value: $6,904,000 ⓘ

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

AM apparatus for manufacturing a fabricated object and method for testing an irr2025
Information processing system, information processing method, program, and subst2025
Information processing system, information processing method, program, and subst2025
Rubber membrane having first and second hardness for use in a polishing head2025
Break-in processing apparatus and break-in processing method2025
Surface height measurement method using dummy disk2025
Buffer chamber and AM system including a buffer chamber2025
Substrate holding apparatus, substrate suction determination method, substrate p2025
Substrate holding apparatus, substrate suction determination method, substrate p2025
Coupling mechanism with spherical bearing, method of determining bearing radius 2025
Film-thickness measuring method, method of detecting notch portion, and polishin2024
Polishing apparatus2024