Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Platform and method of operating for integrated end-to-end self-aligned multi-patterning process

Platform and method of operating for integrated end-to-end self-aligned multi-patterning process

US Patent 11398379 · Granted Jul 26, 2022

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Atomic layer deposition of aluminum oxide films for semiconductor devices using 2025
Extreme ultraviolet lithography patterning method2025
Thermal etching of ruthenium2025
Systems and methods of making polymeric optical layers for optical layering2025
Patterning features with metal based resists2025
Metal hard mask integration2025
Ultra-shallow dopant and ohmic contact regions by solid state diffusion2025
Method of conductive material deposition2025
Selective film formation using a self-assembled monolayer2025
EUV active films for EUV lithography2025
Bonding layer and process of making2025
Method for patterning a substrate using photolithography2025