Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Device, method and system for providing recessed interconnect structures of a substrate

Device, method and system for providing recessed interconnect structures of a substrate

US Patent 11355427 · Granted Jun 7, 2022

Estimated economic value: $12,864,000 ⓘ

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Data storage device and method for hybrid space balancing based on host read aff2025
Flexible printed circuit board arrangement2025
Via plug capacitor2025
Co-planar interconnection mechanisms for circuit boards2025
Substrateless double-sided embedded multi-die interconnect bridge2025
Asymmetrical laminated circuit boards for improved electrical performance2025
Radiation shield and groove in support structure2025
Hybrid boards with embedded planes2025
Radiation shield with zipper2025
Nested architectures for enhanced heterogeneous integration2025
Alternative surfaces for conductive pad layers of silicon bridges for semiconduc2025
Via plug resistor2025