Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Resin composition, copper foil with resin, dielectric layer, copper clad laminate sheet, capacitor element and printed wiring board with built-in capacitor

Resin composition, copper foil with resin, dielectric layer, copper clad laminate sheet, capacitor element and printed wiring board with built-in capacitor

US Patent 11310910 · Granted Apr 19, 2022

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Fuse element, fuse device and protection device2025
Fuse element, fuse device, and protection device2025
Fuse element, fuse device and protection device2025
Protection element2025
Fuse device2025
Semiconductor optical device2025
Information processing system, communication terminal, information processing un2025
Resin composition, copper foil with resin, dielectric layer, copper-clad laminat2025
Resin composition, copper foil with resin, dielectric layer, copper-clad laminat2025
Resin composition, copper foil with resin, dielectric layer, copper-clad laminat2025
Resin composition, copper foil with resin, dielectric layer, copper-clad laminat2025
Resin composition, copper foil with resin, dielectric layer, copper-clad laminat2025