Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Package structure and manufacturing method thereof

Package structure and manufacturing method thereof

US Patent 11289398 · Granted Mar 29, 2022

Estimated economic value: $9,958,000 ⓘ

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Semiconductor package and method of manufacturing the same2025
Semiconductor package2025
Device and method for UBM/RDL routing2025
Packages with metal line crack prevention design2025
Method of manufacturing semiconductor package having lid structure2025
Semiconductor package and manufacturing method thereof2025
Semiconductor structure having through substrate via and manufacturing method th2025
Semiconductor device and method2025
Semiconductor packages2025
Semiconductor package and method for manufacturing the same2025
Methods of manufacturing semiconductor devices2025
Integrated circuit package and method of forming the same2025