Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Chip packaging with multilayer conductive circuit

Chip packaging with multilayer conductive circuit

US Patent 11189555 · Granted Nov 30, 2021

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Package structures2022
Manufacturing method of packaging device2021
Package structures2021
Packaging device and manufacturing method thereof2020
Interconnection structure having a via structure and fabrication thereof2019
Power module package having patterned insulation metal substrate2018
Power module package having patterned insulation metal substrate2018
Power module package having patterned insulation metal substrate2018
Package structure2017
Packaging structure2017
Semiconductor device2016
Semiconductor component having a lateral semiconductor device and a vertical sem2016