Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Packaging structure

Packaging structure

US Patent 9748165 · Granted Aug 29, 2017

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Circuit substrate and electronic device2025
Intelligent power module packaging structure2023
Package structures2022
Power device package structure2022
Chip packaging with multilayer conductive circuit2021
Package structure for power device2021
Heat dissipation substrate for multi-chip package2021
Semiconductor structure employing conductive paste on lead frame2021
Manufacturing method of packaging device2021
Manufacturing method of packaging device2021
Package structures2021
Package structures2021