Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Power module package having patterned insulation metal substrate

Power module package having patterned insulation metal substrate

US Patent 9905439 · Granted Feb 27, 2018

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Engaging structure for hand tool2025
Circuit substrate and electronic device2025
Vehicle control method and smart car key2024
Intelligent power module packaging structure2023
Power module with housing having bending sections2023
Center information display system, vehicle, and method for adjusting view angle 2023
Method for predicting and compensating frictions of feed system, and computer re2023
Semiconductor package with leadframe interconnection structure2022
Package structures2022
Power device package structure2022
Chip packaging with multilayer conductive circuit2021
Package structure for power device2021