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Home › Capacitor interposer layer (CIL) in a die-to-wafer three-dimensional (3D) integrated circuit (IC) (3DIC)

Capacitor interposer layer (CIL) in a die-to-wafer three-dimensional (3D) integrated circuit (IC) (3DIC)

US Patent 11158590 · Granted Oct 26, 2021

Estimated economic value: $25,791,000 ⓘ

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