Preparation of solder bump for compatibility with printed electronics and enhanced via reliability

Assignee

• RTX (Raytheon)

Inventors

• James E. Benedict (33 patents)
• Gregory G. Beninati (7 patents)
• Mikhail Pevzner (11 patents)
• Thomas V. Sikina (55 patents)
• Andrew R. Southworth (21 patents)

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