Issued Patents All Time
Showing 1–21 of 21 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12021306 | Low profile phased array | Thomas V. Sikina, John P. Haven, James E. Benedict, Jonathan E. Nufio-Molina | 2024-06-25 |
| 11653484 | Printed circuit board automated layup system | Mikhail Pevzner, James E. Benedict, Wade A. Schwanda | 2023-05-16 |
| 11632856 | Wall for isolation enhancement | Kevin Wilder, James E. Benedict, Mary K. Herndon, Thomas V. Sikina, John P. Haven | 2023-04-18 |
| 11606865 | Method for forming channels in printed circuit boards by stacking slotted layers | Mikhail Pevzner, Gregory G. Beninati, James E. Benedict | 2023-03-14 |
| 11482795 | Segmented patch phased array radiator | Thomas V. Sikina, John P. Haven, Gregory M. Fagerlund, James E. Benedict, Kevin Wilder | 2022-10-25 |
| 11470725 | Method for fabricating Z-axis vertical launch | Mikhail Pevzner, James E. Benedict, Thomas V. Sikina, Kevin Wilder, Matthew Souza +1 more | 2022-10-11 |
| 11444365 | Radio-frequency (RF)-interface and modular plate | James E. Benedict, Erika Klek, John P. Haven, Michael Souliotis, Thomas V. Sikina +1 more | 2022-09-13 |
| 11375609 | Method of manufacturing radio frequency interconnections | Thomas V. Sikina, James E. Benedict, John P. Haven, Semira M. Azadzoi | 2022-06-28 |
| 11171101 | Process for removing bond film from cavities in printed circuit boards | James E. Benedict, Paul A. Danello, Mikhail Pevzner, Thomas V. Sikina | 2021-11-09 |
| 11158955 | Low profile phased array | Thomas V. Sikina, John P. Haven, James E. Benedict, Jonathan E. Nufio-Molina | 2021-10-26 |
| 11145952 | Advanced communications array | Thomas V. Sikina, John P. Haven, Kevin Wilder, James E. Benedict, Mary K. Herndon | 2021-10-12 |
| 11145977 | Interlocking modular beamformer | Kevin Wilder, Jonathan E. Nufio-Molina, Phillip W. Thiessen, Thomas V. Sikina, James E. Benedict +1 more | 2021-10-12 |
| 11122692 | Preparation of solder bump for compatibility with printed electronics and enhanced via reliability | James E. Benedict, Gregory G. Beninati, Mikhail Pevzner, Thomas V. Sikina | 2021-09-14 |
| 11107610 | Thick film resistors having customizable resistances and methods of manufacture | Erika Klek, Mary K. Herndon, Thomas V. Sikina, James E. Benedict, Kevin Wilder +2 more | 2021-08-31 |
| 11109489 | Apparatus for fabricating Z-axis vertical launch within a printed circuit board | Mikhail Pevzner, James E. Benedict, Thomas V. Sikina, Kevin Wilder, Matthew Souza +1 more | 2021-08-31 |
| 11089687 | Additive manufacturing technology (AMT) low profile signal divider | Jonathan E. Nufio-Molina, Thomas V. Sikina, James E. Benedict, Semira M. Azadzoi | 2021-08-10 |
| 11089673 | Wall for isolation enhancement | Kevin Wilder, James E. Benedict, Mary K. Herndon, Thomas V. Sikina, John P. Haven | 2021-08-10 |
| 10849219 | SNAP-RF interconnections | Thomas V. Sikina, James E. Benedict, John P. Haven, Semira M. Azadzoi | 2020-11-24 |
| 10839992 | Thick film resistors having customizable resistances and methods of manufacture | Erika Klek, Mary K. Herndon, Thomas V. Sikina, James E. Benedict, Kevin Wilder +2 more | 2020-11-17 |
| 10813210 | Radio frequency circuit comprising at least one substrate with a conductively filled trench therein for electrically isolating a first circuit portion from a second circuit portion | Semira M. Azadzoi, James E. Benedict, John P. Haven, Thomas V. Sikina | 2020-10-20 |
| 10631405 | Additive manufacturing technology (AMT) inverted pad interface | James E. Benedict, Timothy David Deley, Thomas V. Sikina, Michael Souliotis, Kevin Wilder | 2020-04-21 |