| 12266629 |
Ball bond impedance matching |
Patrick E. Boyle, James E. Benedict, Erika Klek |
2025-04-01 |
| 12249752 |
Collapsible dielectric standoff |
Channing P. Favreau, Alexander T. Gilbert, Thomas V. Sikina |
2025-03-11 |
| 11653484 |
Printed circuit board automated layup system |
James E. Benedict, Andrew R. Southworth, Wade A. Schwanda |
2023-05-16 |
| 11606865 |
Method for forming channels in printed circuit boards by stacking slotted layers |
Gregory G. Beninati, James E. Benedict, Andrew R. Southworth |
2023-03-14 |
| 11497118 |
Method for manufacturing non-planar arrays with a single flex-hybrid circuit card |
Channing P. Favreau, James E. Benedict, Thomas V. Sikina |
2022-11-08 |
| 11470725 |
Method for fabricating Z-axis vertical launch |
James E. Benedict, Andrew R. Southworth, Thomas V. Sikina, Kevin Wilder, Matthew Souza +1 more |
2022-10-11 |
| 11317502 |
PCB cavity mode suppression |
Thomas V. Sikina, John P. Haven, James E. Benedict, William J. Clark, Channing P. Favreau +4 more |
2022-04-26 |
| 11171101 |
Process for removing bond film from cavities in printed circuit boards |
James E. Benedict, Paul A. Danello, Thomas V. Sikina, Andrew R. Southworth |
2021-11-09 |
| 11122692 |
Preparation of solder bump for compatibility with printed electronics and enhanced via reliability |
James E. Benedict, Gregory G. Beninati, Thomas V. Sikina, Andrew R. Southworth |
2021-09-14 |
| 11109489 |
Apparatus for fabricating Z-axis vertical launch within a printed circuit board |
James E. Benedict, Andrew R. Southworth, Thomas V. Sikina, Kevin Wilder, Matthew Souza +1 more |
2021-08-31 |
| 10999938 |
Method of wire bonding a first and second circuit card |
Donald G. Hersey, Gregory G. Beninati, Thomas J. Tellinghuisen, James E. Benedict |
2021-05-04 |
