| 12388189 |
Orthogonal printed circuit board interface |
Channing P. Favreau, Erika Klek |
2025-08-12 |
| 12362499 |
Polarization versatile radiator |
Jack J. Schuss, Izabella Furman, Robert S. Isom |
2025-07-15 |
| 12249752 |
Collapsible dielectric standoff |
Channing P. Favreau, Mikhail Pevzner, Alexander T. Gilbert |
2025-03-11 |
| 12021306 |
Low profile phased array |
John P. Haven, James E. Benedict, Jonathan E. Nufio-Molina, Andrew R. Southworth |
2024-06-25 |
| 11990677 |
Orthogonal printed circuit board interface |
Channing P. Favreau, Erika Klek |
2024-05-21 |
| 11949216 |
Electromechanical assembly having integrated conductor |
Channing P. Favreau, Alexander T. Gilbert |
2024-04-02 |
| 11632856 |
Wall for isolation enhancement |
Andrew R. Southworth, Kevin Wilder, James E. Benedict, Mary K. Herndon, John P. Haven |
2023-04-18 |
| 11600922 |
Dual band frequency selective radiator array |
Jack J. Schuss, Phillip W. Thiessen |
2023-03-07 |
| 11581652 |
Spiral antenna and related fabrication techniques |
Peter J. Adams, John P. Haven, James E. Benedict |
2023-02-14 |
| 11569574 |
Millimeter wave phased array |
James E. Benedict, John P. Haven, Peter J. Adams |
2023-01-31 |
| 11497118 |
Method for manufacturing non-planar arrays with a single flex-hybrid circuit card |
Channing P. Favreau, James E. Benedict, Mikhail Pevzner |
2022-11-08 |
| 11482795 |
Segmented patch phased array radiator |
John P. Haven, Gregory M. Fagerlund, James E. Benedict, Andrew R. Southworth, Kevin Wilder |
2022-10-25 |
| 11470725 |
Method for fabricating Z-axis vertical launch |
Mikhail Pevzner, James E. Benedict, Andrew R. Southworth, Kevin Wilder, Matthew Souza +1 more |
2022-10-11 |
| 11469520 |
Dual band dipole radiator array |
Jack J. Schuss, Phillip W. Thiessen |
2022-10-11 |
| 11444365 |
Radio-frequency (RF)-interface and modular plate |
James E. Benedict, Erika Klek, John P. Haven, Michael Souliotis, Andrew R. Southworth +1 more |
2022-09-13 |
| 11432408 |
Additive manufactured reactive beamformer |
John P. Haven, Peter J. Adams, James E. Benedict, Carolyn R. Reistad |
2022-08-30 |
| 11375609 |
Method of manufacturing radio frequency interconnections |
James E. Benedict, John P. Haven, Andrew R. Southworth, Semira M. Azadzoi |
2022-06-28 |
| 11336032 |
Reactive array |
John P. Haven, Channing P. Favreau |
2022-05-17 |
| 11317502 |
PCB cavity mode suppression |
John P. Haven, James E. Benedict, William J. Clark, Channing P. Favreau, Erika Klek +4 more |
2022-04-26 |
| 11289814 |
Spiral antenna and related fabrication techniques |
Peter J. Adams, John P. Haven, James E. Benedict |
2022-03-29 |
| 11171101 |
Process for removing bond film from cavities in printed circuit boards |
James E. Benedict, Paul A. Danello, Mikhail Pevzner, Andrew R. Southworth |
2021-11-09 |
| 11158955 |
Low profile phased array |
John P. Haven, James E. Benedict, Jonathan E. Nufio-Molina, Andrew R. Southworth |
2021-10-26 |
| 11145952 |
Advanced communications array |
John P. Haven, Kevin Wilder, James E. Benedict, Andrew R. Southworth, Mary K. Herndon |
2021-10-12 |
| 11145977 |
Interlocking modular beamformer |
Kevin Wilder, Jonathan E. Nufio-Molina, Phillip W. Thiessen, James E. Benedict, Andrew R. Southworth +1 more |
2021-10-12 |
| 11122692 |
Preparation of solder bump for compatibility with printed electronics and enhanced via reliability |
James E. Benedict, Gregory G. Beninati, Mikhail Pevzner, Andrew R. Southworth |
2021-09-14 |
