Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Method for increasing pattern density on a wafer

Method for increasing pattern density on a wafer

US Patent 10923363 · Granted Feb 16, 2021

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Apparatus and method for wafer alignment2025
Method for chuck compensation via wafer shape control2025
Method for chuck compensation via wafer shape control2025
Wafer chuck designs and methods for retaining a processing liquid on a surface o2025
Wet-dry bilayer resist2025
Method to form narrow slot contacts2025
In-situ lithography pattern enhancement with localized stress treatment tuning u2025
In-situ lithography pattern enhancement with localized stress treatment tuning u2025
Contactless capacitive measurement tool with improved throughput and accuracy2025
Hybrid patterning-bonding semiconductor tool2025
3D multiple location compressing bonded arm for advanced integration2025
3D multiple location compressing bonded arm for advanced integration2025