Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Planarization method for a semiconductor substrate using a silicon-containing composition

Planarization method for a semiconductor substrate using a silicon-containing composition

US Patent 10910220 · Granted Feb 2, 2021

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Film-forming composition2025
Film-forming composition2025
Resist underlayer film-forming composition using carbon-oxygen double bond2025
Composition for resist pattern metallization process2025
Composition for resist pattern metallization process2025
Resist underlayer film-forming composition2025
Resist underlayer film-forming composition2025
Resist underlayer film-forming composition2025
Silicon-containing resist underlayer film-forming composition including organic 2025
Film-forming composition2025
Coating composition for pattern inversion2024
Coating composition for pattern inversion2024