Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Endpoint sensor based control including adjustment of an edge ring parameter for each substrate processed to maintain etch rate uniformity

Endpoint sensor based control including adjustment of an edge ring parameter for each substrate processed to maintain etch rate uniformity

US Patent 10903050 · Granted Jan 26, 2021

Estimated economic value: $146,404,000 ⓘ

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Methods and systems for sample analysis2025
Methods and systems for sample analysis2024
Integrated wafer bow measurements2024
Method and apparatus for determining process rate2021
Method and apparatus for determining process rate2021
Apparatus with optical cavity for determining process rate2021
Apparatus with optical cavity for determining process rate2021
Method and apparatus for determining etch process parameters2020
Method and apparatus for determining etch process parameters2020
Plasma etching systems and methods using empirical mode decomposition2019
Plasma etching systems and methods using empirical mode decomposition2019
Gas exhaust by-product measurement system2019