Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Distortion-compensated wafer bonding method and apparatus using a temperature-controlled backside thermal expansion layer

Distortion-compensated wafer bonding method and apparatus using a temperature-controlled backside thermal expansion layer

US Patent 10790296 · Granted Sep 29, 2020

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

High aspect ratio via fill process employing selective metal deposition and stru2025
Systems and methods for non-destructive inspection of semiconductor devices usin2025
Display apparatus, finder apparatus, and imaging apparatus2025
Three-dimensional memory device containing word line contacts which extend throu2025
Three-dimensional memory device containing word line contacts which extend throu2025
Semiconductor device having edge seal and method of making thereof without metal2025
Porous zirconia particles, and aggregate for immobilizing protein2025
Air conditioner2025
Line-of-sight detection device and head mounted display device2025
Three-dimensional memory device containing etch-stop structures and self-aligned2025
Ink for ink-jet printer of charge control type2025
Radiation imaging system, radiation control apparatus, control method of radiati2025