Issued Patents All Time
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11569139 | Electrical overlay measurement methods and structures for wafer-to-wafer bonding | Michiaki Sano, Kazuto Watanabe, Hajime Yamamoto, Takashi Yamaha, Koichi Ito +5 more | 2023-01-31 |
| 10797035 | Bonded assembly containing side bonding structures and methods of manufacturing the same | Michiaki Sano, Takashi Yamaha, Koichi Ito, Ryo Hiramatsu, Kazuto Watanabe +3 more | 2020-10-06 |
| 10790296 | Distortion-compensated wafer bonding method and apparatus using a temperature-controlled backside thermal expansion layer | Takashi Yamaha, Katsuya Kato, Kazuto Watanabe, Hajime Yamamoto, Michiaki Sano +3 more | 2020-09-29 |