Issued Patents All Time
Showing 1–8 of 8 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12090934 | Connecting method and electrical component unit | — | 2024-09-17 |
| 11569139 | Electrical overlay measurement methods and structures for wafer-to-wafer bonding | Ikue Yokomizo, Michiaki Sano, Kazuto Watanabe, Hajime Yamamoto, Takashi Yamaha +5 more | 2023-01-31 |
| 11057978 | Lighting control system and lighting control method | — | 2021-07-06 |
| 10988066 | Communication system, vehicle unit, and seat unit | — | 2021-04-27 |
| 10976993 | Audio control system and audio control method | — | 2021-04-13 |
| 10797035 | Bonded assembly containing side bonding structures and methods of manufacturing the same | Michiaki Sano, Takashi Yamaha, Koichi Ito, Ikue Yokomizo, Kazuto Watanabe +3 more | 2020-10-06 |
| 10790296 | Distortion-compensated wafer bonding method and apparatus using a temperature-controlled backside thermal expansion layer | Takashi Yamaha, Katsuya Kato, Kazuto Watanabe, Hajime Yamamoto, Michiaki Sano +3 more | 2020-09-29 |
| 4577121 | Differential circuit | Yoshiaki Sano, Isamu Omura | 1986-03-18 |