Issued Patents All Time
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12213320 | Three-dimensional memory device with finned support pillar structures and methods for forming the same | Seiji Shimabukuro | 2025-01-28 |
| 11569139 | Electrical overlay measurement methods and structures for wafer-to-wafer bonding | Ikue Yokomizo, Michiaki Sano, Kazuto Watanabe, Hajime Yamamoto, Koichi Ito +5 more | 2023-01-31 |
| 10797035 | Bonded assembly containing side bonding structures and methods of manufacturing the same | Michiaki Sano, Koichi Ito, Ikue Yokomizo, Ryo Hiramatsu, Kazuto Watanabe +3 more | 2020-10-06 |
| 10790296 | Distortion-compensated wafer bonding method and apparatus using a temperature-controlled backside thermal expansion layer | Katsuya Kato, Kazuto Watanabe, Hajime Yamamoto, Michiaki Sano, Koichi Ito +3 more | 2020-09-29 |