Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Conformal low temperature hermetic dielectric diffusion barriers

Conformal low temperature hermetic dielectric diffusion barriers

US Patent 10763161 · Granted Sep 1, 2020

Estimated economic value: $24,773,000 ⓘ

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Subtractively patterned interconnect structures for integrated circuits2025
Bilayer memory stacking with computer logic circuits shared between bottom and t2025
Integrated circuit interconnect structures with graphene cap2025
Backend memory with air gaps in upper metal layers2025
Passivation layers for thin film transistors2025
Stacked backend memory with resistive switching devices2025
Conformal low temperature hermetic dielectric diffusion barriers2025
Conformal low temperature hermetic dielectric diffusion barriers2025
Conformal low temperature hermetic dielectric diffusion barriers2025
Conformal low temperature hermetic dielectric diffusion barriers2025
Interconnect wires including relatively low resistivity cores2025
Sideways vias in isolation areas to contact interior layers in stacked devices2025