Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Imaging element package and camera module having a slit formed in an adhesive connecting a flexible substrate and another member to address differences in linear expansion coefficients

Imaging element package and camera module having a slit formed in an adhesive connecting a flexible substrate and another member to address differences in linear expansion coefficients

US Patent 10720459 · Granted Jul 21, 2020

Estimated economic value: $660,000 ⓘ

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Sensor apparatus2025
EUV mask inspection device, EUV mask inspection method, non-transitory computer-2025
Display device2025
Reader, RFID system, and state detection system2024
Semiconductor device, imaging device, and method of manufacturing semiconductor 2024
Imaging apparatus2024
Display device2024
Semiconductor device, manufacturing method of semiconductor device, and electron2024
Imaging device for connection with a circuit element2023
Imaging device for connection with a circuit element2023
Imaging device2023
Display device2023