Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Discrete power transistor package having solderless DBC to leadframe attach

Discrete power transistor package having solderless DBC to leadframe attach

US Patent 10720376 · Granted Jul 21, 2020

Estimated economic value: $37,483,000 ⓘ

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Discrete power transistor package having solderless DBC to leadframe attach2022
Discrete power transistor package having solderless DBC to leadframe attach2022
Lead and lead frame for power package2020
Lead and lead frame for power package2017
Electrically isolated power semiconductor package with optimized layout2015
Electrically isolated power semiconductor package with optimized layout2014
Lead and lead frame for power package2014
Electrically isolated power semiconductor package with optimized layout2013
Semiconductor power module having an electrically insulating heat sink and metho2009
Induction heating circuit and winding method for heating coils2008
Semiconductor power module having an electrically insulating heat sink and metho2008
Power module package having improved heat dissipating capability2007