Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Reactive ion etching assisted lift-off processes for fabricating thick metallization patterns with tight pitch

Reactive ion etching assisted lift-off processes for fabricating thick metallization patterns with tight pitch

US Patent 10714341 · Granted Jul 14, 2020

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Microfluidic chips with one or more vias filled with sacrificial plugs2025
Solid-state switch2025
Anti-OPG antibodies2025
Multi-layer topological interconnect with proximal doping layer2025
Phase-change memory device with conductive cladding2025
Piezoelectric memory2025
Vanity mirror with second mirror assembly magnetically attached thereto2025
Containers with multiple sensors2025
Phase-change memory cell with mixed-material switchable region2025
Applying inert ion beam etching for improving a profile and repairing sidewall d2025
RRAM filament location for physically unclonable function2025
Antigen binding molecules that bind LIGHT2025